Key Features

 

  • Multi-stations per process module, combined with station-to-station process isolation, results in film performance equivalent to single wafer tools and enhanced throughput
     

  • High temperature capability >630°C
     

  • Comprehensive, modular chemical delivery system
     

  • Efficient footprint, low cost-of-ownership, and low cost-of-consumables
     

  • Unique multi-plenum showerhead designs to ensure precursor isolation for multi-component film deposition

QXP ALD APPLICATIONS

LOGIC

  • Tunable WF metal gates 

  • Doped High-k gate oxides

  • Diffusion barrier films

  • Sacrificial hardmask/ patterning films

NAND

  • Doped blocking oxides

  • Conformal metal

  • Diffusion barrier films

DRAM

  • Bitline and conformal buried word line metal diffusion barrier films

  • High workfunction conformal capacitor electrodes with high density

  • Doped and/or multi-layered High-k capacitor stacks deposited in-situ