The next-generation in HVM ALD performance, results, and cost-efficiency
The single-wafer multi-station QXP ALD product offers a production-proven platform with superior device results, performance, throughput and reliability for high volume manufacturing. The unique combination of multiple sources, including vaporizers integrated with multi-plenum showerhead designs, enables multi-component metal and Hi-k film deposition. The results are excellent step coverage, within-wafer uniformity of key film properties, and precise composition control.
Multi-stations per process module, combined with station-to-station process isolation, results in film performance equivalent to single wafer tools and enhanced throughput
High temperature capability >630°C
Comprehensive, modular chemical delivery system
Efficient footprint, low cost-of-ownership, and low cost-of-consumables
Unique multi-plenum showerhead designs to ensure precursor isolation for multi-component film deposition