Dual ICP plasma source, using patented Durosa™ and Trirosa™ (dual/triple-rotated ICP antenna) for high-density, low-voltage plasma, achieving damage-free treatment of sensitive layers.
Proprietary antenna design ensures excellent plasma stability, enabling longer wet clean intervals and consistent particle control over extended runs.
Operates in both pulse and continuous plasma modes, combined with a bias chuck and multiple WIW tuning knobs for precise uniformity and tailored treatment profiles.
High-temperature capability up to 600°C with high vacuum configuration and turbo pump for a wide process window.
Available in a 4-chamber configuration to support high throughput and multi-recipe flexibility across logic and memory workflows.
