Harrier M

High-throughput batch thermal ALD system

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Mass productivity meets precision engineering

Harrier M is a dual-process batch module thermal ALD system optimized for 3D device structures in advanced memory and logic nodes. With a compact footprint, superior step coverage, and advanced heater control, it delivers exceptional process stability and uniformity.

Key features

50 wafers × 2 process modules = 100 product wafer capacity for high-throughput thermal ALD.
Multi-precursor capability supports nano-laminate process flows and advanced material integration.
State-of-the-art heater technology and high vacuum conductance to provide excellent thermal control and fast cycling.
~100% step coverage on 3D structures with outstanding within-wafer (WIW) thickness uniformity and wafer-to-wafer (WTW) repeatability.
Low particle performance and low defectivity across production runs.
~1.5× higher throughput than conventional batch systems.
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Low CoO, and long cleaning intervals, ideal for high volume production

Applications

Memory

From high-speed DRAM to high-density 3D NAND, our systems are trusted in high-volume production by leading memory fabs.

Explore how we’re building trust and efficiency across every touchpoint – from silicon to software

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