QXP+

Next-generation ALD performance
for high-volume manufacturing

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Advanced thermal ALD, engineered for scale

QXP+ is a significant leap in single-wafer, multi-station thermal ALD technology. It delivers excellent on-wafer and wafer-to-wafer performance, and high throughput for low cost of ownership.

The QXP+ system incorporates modular chemical delivery, concentricity control, and advanced profile tuning. Built for performance, reliability, and cost-efficiency, QXP+ is trusted by global customers for memory and logic applications.

Key features

Four stations per process module with station-to-station process isolation — combines the precision of single-wafer tools with increased throughput
High-temperature capability >630°C
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Compact footprint with low cost-of-ownership and consumables
Multi-zone heater system enables deposition profile modulation and improved film uniformity
Unique lid assembly for concentricity control and station-to-station matching
Unique multi-plenum showerhead architecture ensures precursor isolation in multi-component film deposition
Modular chemical delivery system for flexibility and transparency

Applications

Memory

From high-speed DRAM to high-density 3D NAND, our systems are trusted in high-volume production by leading memory fabs.

Logic

For leading-edge logic nodes and GAA transistors, our ALD solutions enable precise film control and low-defect integration.

Explore how we’re building trust and efficiency across every touchpoint – from silicon to software

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