INNOVATION BUILT IN

Transform to the modern approach to solve your semiconductor challenges and meet customer requirements. It starts with our system engineering and process expertise; advanced R&D collaborations; and world-class, high-volume manufacturing (HVM). With more than 200+ patents, we offer the competitive advantage to get products to market faster and with greater cost-efficiencies than ever before. 

 

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BROAD SOLUTIONS PORTFOLIO

MINI-BATCH & BATCH FURNACE
SINGLE CHAMBER MULTI-STATION THERMAL ALD
SINGLE WAFER THERMAL CVD
PLASMA DENSIFICATION
PLASMA
PRE-CLEAN

Our application lab and innovation centers in Silicon Valley and Korea focus on collaborative research and leverage cutting-edge technical resources to find solutions to your chipmaking challenges with unmatched speed. We continually increase innovation efforts through new and enhanced strategic R&D partnerships, working alongside research groups from universities, industry groups, and clients.

GLOBAL R&D, LOCAL SOLUTIONS

Eugenus partners with Eugene Technology, located at the global hub for world-class, HVM manufacturing, in Hobeop, Korea. The premier semiconductor equipment manufacturing facilities also include comprehensive test and assembly capabilities. To accommodate our increasing customer volume requirements, the manufacturing center was recently expanded to scale capacity for future growth.

ULTRA-MODERN, HIGH VOLUME MANUFACTURING

 

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