INNOVATION BUILT IN

Transform to the modern approach to solve your semiconductor challenges and meet customer requirements. It starts with our system engineering and process expertise; advanced R&D collaborations; and world-class, high-volume manufacturing (HVM). With more than 200+ patents, we offer the competitive advantage to get products to market faster and with greater cost-efficiencies than ever before. 

 

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BROAD SOLUTIONS PORTFOLIO

Falcon

Harrier-M&L

 

PROCESSES

Group IV Thin Films

Metal Thin Films

High-k Films

Low-k Films

PRODUCTS

MINI-BATCH & BATCH FURNACE

PRODUCTS

QXP+ ALD

QXP 8300

 

PROCESSES

Metal Thin Films

High-k Films

SINGLE CHAMBER MULTI-STATION THERMAL ALD

PRODUCTS

BlueJay

IXP CVD

PROCESSES

Group IV Thin Films

Metal Thin Films

Low-k Films

SINGLE WAFER THERMAL CVD

PRODUCTS


Albatross

PROCESSES


Low-k Films

PLASMA DENSIFICATION

PRODUCTS


Hawk

PROCESSES


Low-k Films

PLASMA
PRE-CLEAN

Our application lab and innovation centers in Silicon Valley and Korea focus on collaborative research and leverage cutting-edge technical resources to find solutions to your chipmaking challenges with unmatched speed. We continually increase innovation efforts through new and enhanced strategic R&D partnerships, working alongside research groups from universities, industry groups, and clients.

GLOBAL R&D, LOCAL SOLUTIONS

Eugenus partners with Eugene Technology, located at the global hub for world-class, HVM manufacturing, in Hobeop, Korea. The premier semiconductor equipment manufacturing facilities also include comprehensive test and assembly capabilities. To accommodate our increasing customer volume requirements, the manufacturing center was recently expanded to scale capacity for future growth.

ULTRA-MODERN, HIGH VOLUME MANUFACTURING