PLASMA TREATMENT

Albatross™ Single Plasma Treatment System

Albatross is a high density, low electron temperature, single-wafer system that meets a wide range of plasma surface treatment process needs. Advantages include patented, DUROSA antenna technology, excellent film uniformity, and lower particle generation. 

PLASMA ENHANCED ALD

Phoenix™ Plasma Enhanced ALD System

The high-throughput Phoenix system features unique twin chamber process modules and a patented plasma densification process, and laminar flow for the most challenging applications. Benefits include excellent step coverage thickness, uniformity, and repeatability with our patented Super Cycle Densification Technology. 

The Falcon offers a high throughput alternative to other systems, with multi-stack wafer architecture, independent gas distribution, and wafer rotation. It features excellent within-wafer and wafer-to-wafer thickness uniformity and dopant concentration, lower particle generation, and minimal loading effect.

SELECTIVE EPITAXIAL GROWTH (SEG)

Falcon™ Multi-Stack SEG System

THERMAL LPCVD

BlueJay™ Single Thermal LPCVD System and BlueJay-e™

The BlueJay single wafer system offers unique process flexibility, along with excellent film thickness uniformity and repeatability, and low thermal budgets. The BlueJay-e next generation, compact version offers the same process advantages with a smaller footprint and lower COO.

MINI-BATCH & BATCH FURNACE

Harrier-M™ & Harrier-L

The Harrier™ family of ALD process systems deliver industry-leading performance for batch and mini-batch applications. The Harrier-M mini-batch system features superior precision material engineering, and excellent step coverage and wafer-to-wafer uniformity. The Harrier-L offers high productivity and superior process solutions for 3D device structures.

DRY CLEANING

Hawk™ Dry Cleaning System

Hawk™ is our single-wafer dry cleaning process with gas chemicals for memory and logic device for deep contact plug integration and all epi processes, including Si, SiGe, and III-V materials. The system offers excellent wafer-to-wafer uniformity, high throughput, and easy clustering with the deposition tool.