Key Features


  • Multi-stations per process module, combined with station-to-station process isolation, results in film performance equivalent to single wafer tools and enhanced throughput

  • High temperature capability >630°C

  • Multi-Zone Heater system that modulates deposition profile and improves uniformity

  • Redesign lid assembly to enable station-to-station-matching through concentricity control with uniformity improvement

  • Available features that reduce production overhead and enhance user experience

  • Comprehensive, modular chemical delivery system

  • Efficient footprint, low cost-of-ownership, and low cost-of-consumables

  • Unique multi-plenum showerhead designs to ensure precursor isolation for multi-component film deposition



  • Tunable WF metal gates 

  • Doped High-k gate oxides

  • Diffusion barrier films

  • Sacrificial hardmask/ patterning films

  • Low temperature multi-component materials


  • Doped blocking oxides

  • Conformal metal

  • Diffusion barrier films


  • Bitline and conformal buried word line metal diffusion barrier films

  • High workfunction conformal capacitor electrodes with high density

  • Doped and/or multi-layered High-k capacitor stacks deposited in-situ